Hamamatsu S5106 Chip carrier package for surface mount

$199.00

Hamamatsu S5106 Chip carrier package for surface mount Datasheet

Hamamatsu S5106 Chip carrier package for surface mount

Description

Hamamatsu S5106 Chip carrier package for surface mount

 

The S5106 is a Si PIN photodiode sealed in chip carrier packages suitable for surface mount using automated solder reflow techniques. This photodiode has a large photosensitive area, making it suitable for spatial light transmission where a wide field-of-view angle is required. Other applications include POS scanners, power meters and analytical instruments.

Features
– Photosensitive area: 5 × 5 mm
– Ceramic chip carrier package for surface mount
– Suitable for solder reflow
– High sensitivity
– Packing
Tray: S5106
Reel: S5106-10

 

Specifications

Photosensitive area 5.0 × 5.0 mm
Package Ceramic
Package category Surface mount type
Cooling Non-cooled
Reverse voltage (max.) 30 V
Spectral response range 320 to 1100 nm
Peak sensitivity wavelength (typ.) 960 nm
Photosensitivity (typ.) 0.72 A/W
Dark current (max.) 5000 pA
Cutoff frequency (typ.) 20 MHz
Terminal capacitance (typ.) 40 pF
Noise equivalent power (typ.) 1.6×10-14 W/Hz1/2
Measurement condition Ta=25 ℃, Typ., Photosensitivity: λ=λp, Dark current: VR==10 V, Cutoff frequency: VR=10 V, Terminal capacitance: VR=10 V, f=1 MHz, Noise equivalent power: VR=10 V, λ=λp, unless otherwise noted

 

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